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 CXP856P40
CMOS 8-bit Single Chip Microcomputer For the availability of this product, please contact the sales office.
Description The CXP856P40 is a CMOS 8-bit microcomputer which consists of A/D converter, serial interface, timer/counter, time-base timer, closed caption decoder, data slicer, on-screen display function, I2C bus interface, PWM output, remote control reception circuit, HSYNC counter and watchdog timer as well as basic configuration like 8-bit CPU, PROM, RAM and I/O port. Also this IC provides a power-on reset function and SLEEP function that enables to lower power consumption. CXP856P40 is the PROM-incorporated version of the CXP85640 with built-in mask ROM. This provides the additional feature of being able to write directly into the program (also into the OSD character ROM or caption character ROM possible). Thus, it is most suitable for evaluation use during system development and for smallquantity production. 64 pin SDIP (PIastic) 64 pin QFP (PIastic)
Structure Silicon gate CMOS IC
Features * A wide instruction set (213 instructions) to cover various types of data -- 16-bit operation/multiplication and division/Boolean bit operation instructions * Minimum instruction cycle 333ns at 12MHz operation * Incorporated PROM 40K bytes (Programming) 3K bytes (OSD) 3K bytes (Caption) *Incorporated RAM 1888 bytes (Excludes the closed caption decoder and on-screen display VRAM) * Peripheral functions -- A/D converter 8 bits, 6 channels, successive approximation method (Conversion time of 26.7s/12MHz) -- Serial interface 8-bit clock sync type, 1 channel -- Timer 8-bit timer, 8-bit timer/counter, 19-bit time-base timer -- Closed caption decoder Incorporated decode slicer, conforming to FCC, 8 x 13 dots, 192 character types, 15 character colors, 4 lines x 34 characters, italic, underline, vertical scrolling, 15 frame background colors/half blanking -- On-screen display (OSD) function 12 x 16 dots, 128 character types, 15 character colors, 4 lines x 24 characters, edging (half dot) vertical scrolling for every line 8 frame background colors/half blanking, jitter elimination circuit -- I2C bus interface -- PWM output 8 bits, 4 channels -- Remote control receiver circuit 8-bit pulse measurement counter, 6-stage FIFO -- HSYNC counter 2 channels -- Watchdog timer * Interruption 15 factors, 15 vectors, multi-interruption possible * Standby mode Sleep * Package 64-pin plastic SDIP/QFP
Purchase of Sony's I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conform to the I2C Standard Specifications as defined by Philips. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E96740-PS
VDD Vss
XTAL
INT0 INT1 INT2
VIN
Rex Cap
DATA SLICER
CVDD CVss
CC DECODER
PORT A
8
2 SPC700 CPU CORE
EXTAL
RST
MP
Vpp
Block Diagram
CLOCK GENERATOR/ SYSTEM CONTROL
PA0 to PA7
XLC EXLC R G 3 PROM 40K BYTES RAM 1888 BYTES 2
INTERRUPT CONTROLLER
ON SCREEN DISPLAY
PORT B
8
PB0 to PB7
B I YS YM HSYNC
VSYNC PRESCALER/ TIME BASE TIMER
PORT C
8
PC0 to PC7
SI SO SCK
RMC FIFO
REMOCON
PORT E
HSC0
HSYNC COUNTER 0 8BIT PWM 4CH
HSC1
HSYNC COUNTER 1
I2C BUS INTERFACE UNIT
AN0 to AN5
A/D CONVERTER 6CH
SCL0
SDA0
SDA1
SCL1
PWM0 to PWM3
PORT F
-2-
WATCHDOG TIMER
SERIAL INTERFACE UNIT
EC
8BIT TIMER/COUNTER 0
PORT D
8
PD0 to PD7
3
PE0 to PE2
TO
8BIT TIMER 1
8
PF0 to PF7
CXP856P40
CXP856P40
Pin Assignment (Top View) 64-pin SDIP
PC3 PC2 PC1 PC0 EC/PD7 RMC/PD6 HS1/PD5 HS0/PD4 SI/PD3 SO/PD2 SCK/PD1 INT2/PD0 HSYNC/PA7 VSYNC/PA6 RST Vss XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 CVss Cap Rex VIN CVDD INT1/PB7 PB6 PB5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PC4 PC5 PC6 PC7 PF0/PWM0 PF1/PWM1 PF2/PWM2 PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 PE0/TO PE1 PE2/INT0 MP Vss VDD Vpp EXLC XLC YM YS I B G R PB0 PB1 PB2 PB3 PB4
Note) 1. Vpp (Pin 46) must be connected to VDD. 2. Vss (Pins 16 and 48) must be connected to GND. 3. MP (Pin 49) must be connected to GND. 4. Cap (Pin 26) must be connected to CVSS via a capacitor. 5. Rex (Pin 27) must be connected to CVDD via a resistor of 33k.
-3-
CXP856P40
Pin Assignment (Top View) 64-pin QFP
PD6/RMC
PC0
64 63 62 61 60 59 58 57 56 55 54 53 52 HS1/PD5 HS0/PD4 SI/PD3 S0/PD2 SCK/PD1 INT2/PD0 HSYNC/PA7 VSYNC/PA6 RST Vss XTAL EXTAL PA5/AN5 PA4/AN4 PA3/AN3 PA2/AN2 PA1/AN1 PA0/AN0 CVss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 PE0/TO PE1 PE2/INT0 MP Vss VDD Vpp EXLC XLC YM YS I B G
PC2
PC4
PB4
PF0/PWM0
PB0
Rex
PF1/PWM1
PD7/EC
PC5
PC6
PC7
INT1/PB7
PB3
CVDD
Note) 1. Vpp (Pin 40) must be connected to VDD. 2. Vss (Pins 10 and 42) must be connected to GND. 3. MP (Pin 43) must be connected to GND. 4. Cap (Pin 20 ) must be connected to CVSS via a capacitor. 5. Rex (Pin 21) must be connected to CVDD via a resistor of 33k.
-4-
PB6
PB5
PB2
PB1
Cap
VIN
R
PF2/PWM2
PC1
PC3
CXP856P40
Pin Description Symbol PA0/AN0 to PA5/AN5 PA6/VSYNC PA7/HSYNC PB0 to PB6 PB7/INT1 I/O I/O/Analog input I/O/Input I/O/Input I/O I/O/Input (Port A) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) Description Analog inputs to A/D converter. (6 pins) OSD display vertical sync signal input. OSD display horizontal sync signal input.
(Port B) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) External interruption request input. Active at the falling edge. (Port C) 8-bit I/O port. I/O can be set in a unit of single bits. (8 pins) External interruption request input. Active at the falling edge. (Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA sync current. (8 pins) Serial clock I/O. Serial data output. Serial data input. HSYNC counter (CH0) input. HSYNC counter (CH1) input. Remote control reception circuit input. External event input for timer/counter. (Port E) 3-bit I/O port. I/O can be set in a unit of single bits. (3 pins) (Port F) 8-bit output port with large current (12mA) N-ch open drain output. Lower 4 bits are 12V drive and upper 4 bits are 5V drive. (8 pins) Rectangular wave output for timer/counter.
PC0 to PC7
I/O
PD0/INT2 PD1/SCK PD2/SO PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC PE0/TO PE1 PE2/INT0 PF0/PWM0 to PF3/PWM3 PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1 R, G, B, I, YS, YM
I/O/Input I/O/I/O I/O/Output I/O/Input I/O/Input I/O/Input I/O/Input I/O/Input I/O/Output I/O I/O/Input
Input for external interruption request. Active at the falling edge. 8-bit PWM outputs. (4 pins) Transfer clock I/O for I2C bus interface. (2 pins)
Output/Output
Output/I/O
Output/I/O Output
Transfer data I/O for I2C bus interface. (2 pins)
6-bit OSD display outputs. (6 pins)
-5-
CXP856P40
Symbol EXLC XLC VIN Cap Rex CVDD CVSS EXTAL XTAL RST MP Vpp VDD Vss Input Input
I/O
Description OSD display clock oscillation I/O. Oscillator frequency is determined by the external L and C. External composite video signal input. Input a 2Vp-p signal via a capacitor.
Output Input -- --
Connects a capacitor for the data slicer between Cap and CVSS. Connects a 33k resistor for the data slicer between Rex and CVDD. Positive power supply for data slicer. GND for data slicer. Connects a crystal for system clock oscillation. When an external clock is supplied, input it to EXTAL and leave XTAL open. System reset; active at Low level I/O pin. Outputs a Low level when the power is turned on and the power-on reset function operates. Test mode input. Must be connected to GND. Positive power supply for internal PROM writing. Under normal conditions, connect to VDD. Positive power supply. GND. Connect two VSS pins to GND.
Output I/O Input
-6-
CXP856P40
Input/Output Circuit Formats for Pins Pin Port A
Port A data
Circuit format
When reset
Port A direction
IP
PA0/AN0 to PA5/AN5
"0" when reset Data bus RD (Port A) Port A function selection "0" when reset A/D converter
Input protection circuit
Hi-Z
6 pins Port A
Input multiplexer
Port A data
Port A direction "0" when reset IP
PA6/VSYNC PA7/HSYNC
Data bus RD (Port A)
Hi-Z
Schmitt input
VSYNC, HSYNC
2 pins Port B Port C
Port B, C data
Input polarity "0" when reset
PB0 to PB6 PB7/INT1 PC0 to PC7
Data bus
Port B, C direction "0" when reset
IP
Hi-Z
RD (Port B, C) INT1
Schmitt input
16 pins
-7-
CXP856P40
Pin Port D
Circuit format
When reset
Port D data
PD0/INT2 PD3/SI PD4/HS0 PD5/HS1 PD6/RMC PD7/EC
Port D direction "0" when reset Schmitt input Data bus RD (Port D)
IP
Hi-Z
6 pins
INT2, SI, HS0, HS1, RMC, EC
Large current 12mA
Port D
SCK, SO Serial output enable
Port D data
PD1/SCK PD2/SO
Port D direction "0" when reset Data bus Schmitt input
IP
Hi-Z
RD (Port D) SCK only
2 pins Port E
Large current 12mA
TO Port E function selection "1" when reset
PE0/TO PE1 PE2/INT0
Port E data "1" when reset for PE0, 1 Port E direction "0" when reset for PE2 Schmitt input only for PE2 IP
PE0, PE1: High level PE2: Hi-Z
Data bus RD (Port E) INT0
3 pins
-8-
CXP856P40
Pin Port F PF0/PWM0 to PF3/PWM3
PWM0 to PWM3 Port F selection "0" when reset Port F data "1" when reset
Circuit format
When reset
Hi-Z
12V drive Large current 12mA
4 pins Port F
SCL, SDA I2C output enable
PF4/SCL0 PF5/SCL1 PF6/SDA0 PF7/SDA1
Port F data "1" when reset SCL, SDA (I2C circuit) Schmitt input
Hi-Z
IP BUS SW To internal I2C pins (SCL1 for SCL0)
4 pins
Large current 12mA
R G B I YS YM 6 pins
R, G, B, I, YS, YM
Output polarity "0" when reset Output becomes active by data writing to output port register.
Hi-Z
EXLC XLC
EXLC
IP
Oscillator control
Oscillation halted
XLC IP OSD display clock
2 pins
-9-
CXP856P40
Pin
Circuit format
When reset
EXTAL XTAL
* Diagram shows the circuit composition during oscillation. EXTAL IP * Feedback resistor is removed during stop. (This device does not enter the STOP mode.)
Oscillation
XTAL
2 pins
Pull-up resistor
RST
Schmitt input
Low level
From power-on reset circuit
1 pin
- 10 -
CXP856P40
Absolute Maximum Ratings Item Supply voltage Input voltage Output voltage Mid-voltage drive output voltage High level output current High level total output current Symbol VDD Vpp VIN VOUT VOUTP IOH IOH IOL Low level output current IOLC Low level total output current Operating temperature Storage temperature Allowable power dissipation IOL Topr Tstg PD 20 100 -10 to +75 -55 to +150 1000 600 mA mA C C mW mW SDIP QFP Ratings -0.3 to +7.0 -0.3 to +13.0 -0.3 to +7.01 -0.3 to +7.01 -0.3 to +15.0 -5 -50 15 Unit V V V V V mA mA mA
(Vss = 0V reference) Remarks
Incorporated PROM
PF0 to PF3 pins
Total of all output pins Ports excluding large current output (value per pin) Large current output port (value per pin)2 Total of all output pins
1 VIN and VOUT should not exceed VDD + 0.3V. 2 The large current output port is Port D (PD) and Port F (PF). Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding those conditions may adversely affect the reliability of the LSI. Recommended Operating Conditions Item Symbol Min. 4.5 VDD Supply voltage 3.5 2.5 Vpp Data slicer supply voltage High level input voltage CVDD VIH VIHS VIHEX VIL Low level input voltage Operating temperature VILS VILEX Topr Max. 5.5 5.5 5.5 Unit V V V V V V V V V V V C (Vss = 0V reference) Remarks Guaranteed operation range for 1/2 and 1/4 frequency dividing modes Guaranteed operation range for 1/16 frequency dividing mode or sleep mode Guaranteed data hold range for stop mode1 6 5 2 3 EXTAL pin4 2 3 EXTAL pin4
Vpp = VDD 4.5 0.7VDD 0.8VDD VDD - 0.4 0 0 -0.3 -10 5.5 VDD VDD VDD + 0.3 0.3VDD 0.2VDD 0.4 +75
1 This device does not enter the STOP mode. 2 PA, PB, PC, PE0 to PE1, SCL0 to SCL1, SDA0 to SDA1 pins. 3 INT2, SCK, SO, SI, HS0, HS1, RMC, EC, INT1, HSYNC, VSYNC, RST pins. 4 Specifies only during external clock input. 5 CVDD and VDD should be set to the same voltage. 6 Vpp and VDD should be set to the same voltage. - 11 -
CXP856P40
DC Characteristics Item High level output voltage
Symbol
(Ta = -10 to +75C, Vss = 0V reference) Pin PA to PD, PE, R, G, B, I, YS, YM PA to PD, PE, R, G, B, I, YS, YM, PF0 to PF3, RST1 Condition VDD = 4.5V, IOH = -0.5mA VDD = 4.5V, IOH = -1.2mA VDD = 4.5V, IOL = 1.8mA VDD = 4.5V, IOL = 3.6mA VDD = 4.5V, IOL = 12.0mA VDD = 4.5V, IOL = 3.0mA VDD = 4.5V, IOL = 4.0mA VDD = 5.5V, VIH = 5.5V VDD = 5.5V, VIL = 0.4V RST2 PA to PE, HSYNC, VSYNC, R, G, B, I, YS, YM, RST2 PF0 to PF3 ILOH PF4 to PF7 SCL0: SCL1 SDA0: SDA1 VDD = 5.5V, VOH = 5.5V VDD = 4.5V VSCL0 = VSCL1 = 2.25V VSDA0 = VSDA1 = 2.25V 1/2 frequency dividing mode VDD = 5.5V 12MHz crystal oscillation (C1 = C2 = 15pF) VDD3 Sleep mode VDD = 5.5V 12MHz crystal oscillation (C1 = C2 = 15pF) Stop mode4 VDD = 5.5V 12MHz crystal oscillation VDD = 5.5V 10 120 A VDD = 5.5V, VIL = 0.4V VDD = 5.5V, VI = 0, 5.5V VDD = 5.5V, VOH = 12.0V 0.5 -0.5 -1.5 Min. 4.0 3.5 0.4 0.6 1.5 0.4 0.6 40 -40 -400 10 50 Typ. Max. Unit V V V V V V V A A A A A
VOH
Low level output voltage
VOL
PD, PF PF4 to PF7 (SCL0, SCL1, SDA0, SDA1)
IIHE Input current IIHL IILR I/O leakage current Open drain output leak current (in N-ch Tr off state) IIZ
EXTAL
I2C bus switch connection impedance RBS (in output Tr off state)
IDD
40
50
mA
Supply current
IDDSL
1.0
5
mA
IDDST ICVDD Input capacitance CIN CVDD
-- --
-- 5.0 10
-- 10.0 20
A mA pF
PA to PE, SCL, SDA, 1MHz clock EXLC, EXTAL, VIN, 0V for no-measured pins RST
1 Specifies RST pin only when the power-on reset circuit is selected with mask option. 2 For RST pin, specifies the input current when pull-up resistance is selected, and specifies the leakage current when non-resistance is selected. 3 When all output pins are left open. Specifies only when the OSD oscillation is halted. 4 This device does not enter the stop mode.
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CXP856P40
AC Characteristics (1) Clock timing Item System clock frequency System clock input pulse width System clock rise and fall times Event counter input clock pulse widtth Event counter input clock rise and fall times Symbol fC Pin XTAL EXTAL EXTAL EXTAL EC EC
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Condition Fig. 1, Fig. 2 Fig. 1, Fig. 2 External clock drive Fig 1, Fig 2 External clock drive Fig. 3 Fig. 3 Min. Typ. 12.0 Max. Unit MHz ns ns ns 20 ms
tXL, tXH tCR, tCF tEH, tEL tER, tEF
37.5 200
tsys1 + 50
1 Indicates three values according to the contents of the clock control register (CLC: 00FEH) upper 2 bits (CPU clock selection).
tsys (ns) = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
Fig. 1. Clock timing
1/fc
VDD - 0.4V EXTAL 0.4V tXH tCF tXL tCR
Fig. 2. Clock applied condition
Crystal oscillation Ceramic oscillation
External clock
EXTAL
XTAL
EXTAL
XTAL
C1
C2
OPEN
Fig. 3. Event count clock timing
0.8VDD EC 0.2VDD tEH tEF tEL tER
- 13 -
CXP856P40
(2) Serial transfer Item SCK cycle time SCK high and low level widths SI input set-up time (for SCK ) SI input hold time (for SCK ) SCK SO delay time Symbol Pin SCK
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Condition Input mode Output mode SCK SCK input mode SCK output mode SI SCK input mode SCK output mode SI SCK input mode SCK output mode SO SCK input mode SCK output mode Min. 1000 8000/fc 400 4000/fc - 50 100 200 200 100 200 100 Max. Unit ns ns ns ns ns ns ns ns ns ns
tKCY tKH tKL tSIK tKSI tKSO
Note) The load of SCK output mode and SO output delay time is 50pF + 1TTL.
Fig. 4. Serial transfer timing
tKCY tKL tKH
0.8VDD SCK 0.2VDD
tSIK
tKSI
0.8VDD SI Input data 0.2VDD
tKSO
0.8VDD SO 0.2VDD Output data
- 14 -
CXP856P40
(3) A/D converter characteristics Item Resolution Linearity error Zero transition voltage Full-scale transition voltage Conversion time Sampling time Analog input voltage VZT1 VFT2 Symbol Pin
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Condition Min. Typ. Max. 8 3 Ta = 25C VDD = 5.0V Vss = 0V -50 4910 160/fADC3 12/fADC3 10 4970 70 5030 Unit Bits LSB mV mV s s VDD V
tCONV tSAMP
VIAN AN0 to AN5
0
Fig. 5. Definitions for A/D converter terms
FFH FEH
Digital conversion value
1 Value at which the digital conversion value changes from 00H to 01H and vice versa. 2 Value at which the digital conversion value changes from
Linearity error
FEH to FFH and vice versa. 3 fADC indicates the below values due to the contents of bit 6 (CKS) of the A/D control register (ADC: 00F9H) and bits 7 (PCK1) and 6 (PCK0) of the clock control register (CLC: 00FEH).
01H 00H
VZT Analog input
VFT
CKS PCK1, 0 00 ( = fEX/2) 01 ( = fEX/4) 11 ( = fEX/16)
0 (/2 selection) fADC = fC/2 fADC = fC/4 fADC = fC/16
1 ( selection) fADC = fC fADC = fC/2 fADC = fC/8
- 15 -
CXP856P40
(4) Interruption, reset input Item External interruption High and Low level widths Reset input Low level width
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol Pin INT0 INT1 INT2 RST Condition Min. 1 32/fc Max. Unit s s
tIH tIL tRSL
Fig. 6. Interruption input timing
tIH INT0 INT1 INT2 (falling edge) tIL
0.8VDD 0.2VDD
Fig. 7. RST input timing
tRSL
RST 0.2VDD
(5) Power-on reset Item Power supply rise time Power supply cutt-off time Symbol Pin VDD
(Ta = -10 to +75C, Vss = 0V reference) Condition Power-on reset Repeated power-on reset Min. 0.05 1 Max. 50 Unit ms ms
tR tOFF
Fig. 8. Power-on reset
VDD
4.5V 0.2V 0.2V tR Take care when turning the power on. tOFF
- 16 -
CXP856P40
(6) I2C bus timing Item SCL clock frequency Bus-free time before starting transfer Hold time for starting transfer Clock Low level width Clock High level width Setup time for repeated transfers Data hold time Data setup time SDA, SCL rise time SDA, SCL fall time Setup time for transfer completion
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol fSLC Pin SCL SDA, SCL SDA, SCL SCL SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL SDA, SCL 4.7 Condition Min. 0 4.7 4.0 4.7 4.0 4.7 01 250 1 300 Max. 100 Unit kHz s s s s s s ns s ns s
tBUF tHD; STA tLOW tHIGH tSU; STA tHD; DAT tSU; DAT tR tF tSU; STO
1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it.
Fig. 9. I2C bus transfer timing
SDA tBUF tR SCL tHD; STA tSU; STA P S tLOW tHD; DAT tHIGH tSU; DAT St tSU; STO P tF tHD; STA
Fig. 10. I2C device recommended circuit
I2C device RS SDA0 (or SDA1) SCL0 (or SCL1) RS RS
I2C device RS RP RP
* A pull-up resistor must be connected to SDA0 (or SDA1) and SCL0 (or SCL1). * The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300 or less) can be used to reduce spike noise caused by CRT flashover.
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CXP856P40
(7) OSD timing Item OSD clock frequency HSYNC pulse width HSYNC after-write rise and fall times VSYNC before-write rise and fall times
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol fOSC Pin EXLC XLC HSYNC HSYNC VSYNC Condiiton Fig. 12 Fig. 11 Fig. 11 Fig. 11 Min. 4 1.2 200 1.0 Max. 16.5 Unit MHz s ns s
tHWD tHCG tVCG
Fig. 11. OSD timing
tHWD tHCG
HSYNC For OSD I/O polarity register (OPOL: 01FDH) bit 7 at "0"
0.8VDD
0.2VDD
tVCG
VSYNC For OSD I/O polarity register (OPOL: 01FDH) bit 6 at "0"
0.8VDD
0.2VDD
Fig. 12. LC oscillation circuit connection
EXLC
XLC R1 L
C1
C2
1 The XLC series resistor can reduce the occurrence of undersired radiation.
- 18 -
CXP856P40
(8) Data slicer external circuit Item Symbol Pin VIN
(Ta = -10 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference) Min. Typ. 0.47 Max. Unit F Remarks The B characteristic or more of temperature characteristics is recommended. The B characteristic or more of temperature characteristics is recommended.
VIN pin coupling capacitance CVIN
Cap pin capacitance Rex pin pull-up resistance
Ccap Rrex
Cap Rex
4700 33 2.0
pF k Vp-p
Composite video signal input Video In VIN
Fig. 13. Data slicer external recommended circuit
5.0V
CVDD Rrex Rex CVIN R1 VIN Video In R2 C1
Cap Ccap CVss
[Recommended Constant] R1 = 100 (error: 5%; allowable power dissipation: 1/8W or more) R2 = 1M (error: 5%; allowable power dissipation: 1/8W or more) C1 = 820pF (ceramic), the B characteristic or more of temperature characteristics is recommended.
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CXP856P40
Supplement Fig. 14. SPC700 Series recommended oscillation circuit (i)
EXTAL
XTAL Rd
C1
C2
Manufacturer RIVER ELETEC CO., LTD. KINSEKI LTD.
Model HC-49/U03 HC-19/U (-S)
fc (MHz) 12.0 12.0
C1 (pF) 5 15
C2 (pF) 5 15
Rd () 01 01
Circuit example (i) (i)
1 The XTAL series resistor can reduce the effect of electrostatic discharge noise.
Products List Option item Package Program ROM capacity Reset-pin pull-up resistor Power-on reset circuit Font data Mask 64-pin plastic SDIP/QFP 32/40K bytes Existent/Non-existent Existent/Non-existent User specified CXP856P40S-1CXP856P40Q-164-pin plastic SDIP/QFP PROM 40K bytes Existent Existent User specified (PROM)2
2 The font data for the one-time PROM version can be written in the same way as for the program.
- 20 -
CXP856P40
Fig. 15. Characteristics curves
IDD vs. VDD
(fc = 12MHz, Ta = 25C, Typical) 100 50 1/2 frequency dividing mode 45 1/4 frequency dividing mode
IDD vs. fc
(VDD = 5V, Ta = 25C, Typical)
40
10
35 1/16 frequency dividing mode
IDD - Supply current [mA]
1/2 frequency dividing mode
IDD - Supply current [mA]
30
25
20 1/4 frequency dividing mode 15
1
SLEEP mode
10
1/16 frequency dividing mode
5 SLEEP mode 0.1 2 3 4 5 6 0 4 8 fc - System clock [MHz] 12 16
VDD - Supply voltage [V]
Parameter curve for OSD oscillation L vs. C
(Theoretically calculated value) 100
L - Inductance [H]
10
10MHz 12MHz 14MHz 16MHz fOSC = 0 1 2 LC 50 C1, C2 - Capacitance [pF] C= C1 C2 C1 + C2 100
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CXP856P40
Package Outline
Unit: mm
64PIN SDIP (PLASTIC) 750mil
+ 0.4 57.6 - 0.1 64 33
19.05 + 0.3 17.1 - 0.1
+ 0.1 0.05 0.25 -
0 to 15 32 0.5 0.1 0.9 0.15
1 1.778
PACKAGE STRUCTURE
MOLDING COMPOUND SONY CODE EIAJ CODE JEDEC CODE SDIP-64P-01 SDIP064-P-0750-A LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 8.6g
64PIN QFP(PLASTIC)
23.9 0.4 + 0.4 20.0 - 0.1
51 33
3 MIN
0.5 MIN + 0.4 4.75 - 0.1
+ 0.1 0.15 - 0.05 0.15
52
32
17.9 0.4
+ 0.4 14.0 - 0.1
64
20
+ 0.2 0.1 - 0.05
1 1.0 + 0.15 0.4 - 0.1
19 + 0.35 2.75 - 0.15 0.12 M
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE QFP-64P-L01 QFP064-P-1420 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER/PALLADIUM PLATING COPPER /42 ALLOY 1.5g
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0.8 0.2
16.3


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